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SST39LF040

4Mb 3-3.6V Parallel Flash

Status: In Production

Features:

  • Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
  • Single Voltage Read and Write Operations– 3.0-3.6V for SST39LF512/010/020/040– 2.7-3.6V for SST39VF512/010/020/040
  • Superior Reliability– Endurance: 100,000 Cycles (typical)– Greater than 100 years Data Retention
  • Low Power Consumption(typical values at 14 MHz)– Active Current: 5 mA (typical)– Standby Current: 1 µA (typical)
  • Sector-Erase Capability– Uniform 4 KByte sectors
  • Fast Read Access Time:–  55 ns for SST39LF020/040– 70 ns for SST39VF512/010/020/040
  • Latched Address and Data
  • Fast Erase and Byte-Program:– Sector-Erase Time: 18 ms (typical)– Chip-Erase Time: 70 ms (typical)– Byte-Program Time: 14 µs (typical)– Chip Rewrite Time:1 second (typical) for SST39LF/VF5122 seconds (typical) for SST39LF/VF0104 seconds (typical) for SST39LF/VF0208 seconds (typical) for SST39LF/VF040
  • Automatic Write Timing– Internal VPP Generation
  • End-of-Write Detection– Toggle Bit– Data# Polling
  • CMOS I/O Compatibility
  • JEDEC Standard– Flash EEPROM Pinouts and command sets
  • Packages Available– 32-lead PLCC– 32-lead TSOP (8mm x 14mm)– 48-ball TFBGA (6mm x 8mm)– 34-ball WFBGA (4mm x 6mm) for 1M and 2M
  • All devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST39LVF040 is a 5124K x8CMOS Multi-Purpose Flash (MPF) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick-oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. The SST39LF040 device writes (Program or Erase) with a 3.0-3.6V power supply. The device conforms to JEDEC standard pinouts for x8 memories.

Additional Features
    • Organized as 64K x8 / 128K x8 / 256K x8 / 512K x8
    • Single Voltage Read and Write Operations– 3.0-3.6V for SST39LF512/010/020/040– 2.7-3.6V for SST39VF512/010/020/040
    • Superior Reliability– Endurance: 100,000 Cycles (typical)– Greater than 100 years Data Retention
    • Low Power Consumption(typical values at 14 MHz)– Active Current: 5 mA (typical)– Standby Current: 1 µA (typical)
    • Sector-Erase Capability– Uniform 4 KByte sectors
    • Fast Read Access Time:–  55 ns for SST39LF020/040– 70 ns for SST39VF512/010/020/040
    • Latched Address and Data
    • Fast Erase and Byte-Program:– Sector-Erase Time: 18 ms (typical)– Chip-Erase Time: 70 ms (typical)– Byte-Program Time: 14 µs (typical)– Chip Rewrite Time:1 second (typical) for SST39LF/VF5122 seconds (typical) for SST39LF/VF0104 seconds (typical) for SST39LF/VF0208 seconds (typical) for SST39LF/VF040
    • Automatic Write Timing– Internal VPP Generation
    • End-of-Write Detection– Toggle Bit– Data# Polling
    • CMOS I/O Compatibility
    • JEDEC Standard– Flash EEPROM Pinouts and command sets
    • Packages Available– 32-lead PLCC– 32-lead TSOP (8mm x 14mm)– 48-ball TFBGA (6mm x 8mm)– 34-ball WFBGA (4mm x 6mm) for 1M and 2M
    • All devices are RoHS compliant
Parametrics
Name
Value
Density
4 Mbit
Op. Volt Range (V)
3 to 3.6
Max. Clock Freq.
1KHz
Read Access Time
55 ns
Temp Range (°C)
0°C to +70°C
Endurance
100,000

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12/19/2017
3698KB

Product Brief

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST39LF040-55-4C-NHE
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
SST39LF040-55-4C-NHE-RVL-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
SST39LF040-55-4C-NHE-T
1.129000
1.896000
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
SST39LF040-55-4C-NHE-RVL
1.129000
2.333333
32
PLCC
11.5x14x3.37mm
Matte Tin
e3
SST39LF040-55-4C-WHE
0.249700
1.442308
32
TSOP
8x14mm
Matte Tin
e3
SST39LF040-55-4C-WHE-RVL
0.249700
1.442308
32
TSOP
8x14mm
Matte Tin
e3
SST39LF040-55-4C-WHE-T
0.249700
0.333333
32
TSOP
8x14mm
Matte Tin
e3
SST39LF040-55-4C-WHE-RVL-T
0.249700
0.333333
32
TSOP
8x14mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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