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MCP2210

USB to SPI Converter with GPIO (Master Mode)

Status: In Production

Features:

  • Supports full-speed USB (12 Mb/s)
  • Human Interface Device (HID) device
  • 64-byte transmit
  • 64-byte receive
  • Fully configurable VID, PID assignments and string descriptors
  • Bus powered (factory default) or self-powered (can be selected through special USB commands)
  • USB 2.0 Compliant
  • Uses standard HID drivers (built-in support on Windows® XP, Vista, 7, Linux and Mac OS®)
  • Configuration utility for device’s power-up configuration
  • Utility for USB-SPI communication, GPIO manipulation and miscellaneous features usage
  • Supports all four SPI modes (Mode 0, 1, 2, 3)
  • Bit-rates from 1500 bps up to 12 Mbps
  • Chip Select (assert) to 1st byte of data delay
  • Data to data delay
  • Data to Chip Select (de-assert) delay
  • SPI transactions lengths of up to 65535 bytes long
  • Up to 9 Chip Select lines – to be used in any combination for a given SPI transaction (the chip select lines are shared between GPIOs and alternate function pins; certain GPs – up to 9 of them – can be assigned with the chip select functionality)
  • Nine general purpose I/O pins
  • 256 bytes of user EEPROM (accessible only through certain USB commands)
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The MCP2210 device is a USB-to-SPI Master converter which enables USB connectivity in applications that have an SPI interface. The device reduces external components by integrating the USB termination resistors. The MCP2210 also has 256 bytes of integrated user EEPROM. The MCP2210 has nine general purpose input/output pins. Seven pins have alternate functions to indicate USB and communication status.

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Additional Features

      Universal Serial Bus (USB)

      • Supports full-speed USB (12 Mb/s)
      • Human Interface Device (HID) device
      • 128-byte Buffer to handle data throughput:
        • 64-byte transmit
        • 64-byte receive
      • Fully configurable VID, PID assignments and string descriptors
      • Bus powered (factory default) or self-powered (can be selected through special USB commands)
      • USB 2.0 Compliant

      USB Driver and Software Support

      • Uses standard HID drivers (built-in support on Windows® XP, Vista, 7, Linux and Mac OS®)
      • Configuration utility for device’s power-up configuration
      • Utility for USB-SPI communication, GPIO manipulation and miscellaneous features usage

      SPI Master peripheral

      • Supports all four SPI modes (Mode 0, 1, 2, 3)
      • Bit-rates from 1500 bps up to 12 Mbps
      • Configurable delays for SPI transactions:
        • Chip Select (assert) to 1st byte of data delay
        • Data to data delay
        • Data to Chip Select (de-assert) delay
      • SPI transactions lengths of up to 65535 bytes long
      • Up to 9 Chip Select lines – to be used in any combination for a given SPI transaction (the chip select lines are shared between GPIOs and alternate function pins; certain GPs – up to 9 of them – can be assigned with the chip select functionality)

      General Purpose Input/Output (GPIO) Pins

      • Nine general purpose I/O pins

      EEPROM

      • 256 bytes of user EEPROM (accessible only through certain USB commands)
Parametrics
Name
Value
Description
USB-to-SPI Protocol Converter with GPIO (Master Mode)
Upstream Port
USB 2.0
USB Speed
Full Speed
Downstream Ports
SPI
MCU Interface
SPI
Tx Buffer Size (bytes)
64
Rx Buffer Size (bytes)
64
GPIOs
9
Op Voltage (V)
3.3 to 5.5
MGMT I/F
SPI
Temp Range Min (°C)
-40
Temp Range Max (°C)
85

Documents

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Software

05/17/2016
3451KB
03/09/2018
15KB
02/17/2015
12492KB
04/21/2015
4294KB
01/30/2012
395KB
12/19/2017
15674KB

User Guides

Development Environment

  • Demo & Evaluation Boards
  • Application Examples
Demo & Evaluation Boards
MCP2210 Breakout Module
MCP2210 Breakout Module ( ADM00419 )

The MCP2210 Breakout Module can be used with either the MCP2210 Motherboard or as a standalone USB to SPI (Master) bridge module. The breakout board provides all the needed signals in order to assist the user in building their own boards using the MCP2210. The MCP2210 Utility software allows custom device configuration. In addition, a DLL package is also available in order to allow development of...

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MCP2210 Evaluation Kit
MCP2210 Evaluation Kit ( ADM00421 )

The MCP2210 Evaluation Kit is a development and evaluation platform for the MCP2210 device. The MCP2210 Motherboard is designed to work together with the MCP2210 Breakout Board. The motherboard provides the test points needed for measurements and it also contains the following SPI slave chips:
- MCP23S08 – 8 bit I/O expander
- MCP3204 – 4 channel, 12-bit ADC
-...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP2210-I/SO
0.542000
0.973684
20
SOIC
.300in
Matte Tin
e3
MCP2210T-I/SO
0.542000
0.311875
20
SOIC
.300in
Matte Tin
e3
MCP2210T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2210-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2210-I/SSVAO
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2210T-I/SSVAO
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2210T-I/MQ
0.067130
0.166970
20
QFN
5x5x0.9mm
Matte Tin
e3
MCP2210-I/MQ
0.067130
0.109589
20
QFN
5x5x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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