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SST39VF400A

4Mb 2.7-3.6V Parallel Flash

Status: Not Recommended for new designs

Features:

  • Organized as 256K x16
  • Single Voltage Read and Write Operations – 2.7-3.6V
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Please consider this device SST39VF401C, SST39VF402C

Additional Features
  • Organized as 256K x16
  • Single Voltage Read and Write Operations – 2.7-3.6V
  • Superior Reliability– Endurance: 100,000 Cycles (typical), Greater than 100 years Data Retention
  • Low Power Consumption (typical values at 14 MHz)
    • Active Current: 9 mA (typical)– Standby Current: 3 µA (typical)
  • Sector-Erase Capability– Uniform 2 KWord sectors
  • Block-Erase Capability– Uniform 32 KWord blocks
  • Fast Read Access Time– 70 ns for SST39VF400A
  • Fast Erase and Word-Program
    • Sector-Erase Time: 18 ms (typical)
    • Block-Erase Time: 18 ms (typical)
    • Chip-Erase Time: 70 ms (typical)
    • Word-Program Time: 14 µs (typical)
    • Chip Rewrite Time:4 seconds (typical) for SST39VF400A
    • Automatic Write Timing– Internal VPP Generation
    • End-of-Write Detection– Toggle Bit– Data# Polling
  • JEDEC Standard– Flash EEPROM Pinouts and command sets
  • Packages Available– 48-lead TSOP (12mm x 20mm), 48-ball TFBGA (6mm x 8mm) , 48-ball WFBGA (4mm x 6mm), 48-bump XFLGA (4mm x 6mm)
    • All non-Pb (lead-free) devices are RoHS compliant
Parametrics
Name
Value
Density
4 Mbit
Op. Volt Range (V)
2.7 to 3.6
Read Access Time
70 ns
Temp Range (°C)
-40°C to +85°C
Endurance
100,000

Documents

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Board Design Files

  
30KB
  
30KB

Software Libraries/Firmware


Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST39VF400A-70-4C-V-CZ036
0.000000
1000.000
0
Wafer
Varies
-
-
SST39VF400A-70-4C-V-CZ053
0.000000
1000.000
0
Wafer
Varies
-
-
SST39VF400A-70-4I-V-CZ105
0.000000
1000.000
0
Wafer
Varies
-
-
SST39VF400A-70-4C-V-CZ113
0.000000
1000.000
0
Wafer
Varies
-
-
SST39VF400A-70-4I-VJ-WAC
0.000000
1000.000
0
Wafer
Varies
-
-
SST39VF400A-70-4I-V-CZ036
0.000000
1000.000
0
Wafer
Varies
-
-
SST39VF400A-70-4C-UJ
0.000000
1000.000
0
DICE
Varies
-
-
SST39VF400A-70-4C-VJ
0.000000
1000.000
0
WAFER
Varies
-
-
SST39VF400A-70-4I-VJ
0.000000
1000.000
0
WAFER
Varies
-
-
SST39VF400A-70-4I-M1QE-T
0.028100
0.276667
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4C-M1QE
0.028100
0.513514
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4I-M1QE
0.028100
0.513514
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4I-C1QE
0.025500
0.162162
48
XFLGA
4x6x0.6mm
SAC
e1
SST39VF400A-70-4C-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF400A-70-4C-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF400A-70-4I-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF400A-70-4I-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
SST39VF400A-70-4I-MAQE
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4C-MAQE
0.028700
0.459460
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4C-MAQE-T
0.028700
0.240800
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4I-MAQE-T
0.028700
0.240800
48
WFBGA
4x6x0.73mm
SAC
e1
SST39VF400A-70-4C-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF400A-70-4C-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
SST39VF400A-70-4I-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
SST39VF400A-70-4I-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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