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PIC32MX675F512H

Status: In Production

Features:

  • 80MHz/105DMIPS, 32-bit MIPS M4K Core
  • USB 2.0 On-The-Go Peripheral with integrated PHY
  • 10/100 Ethernet MAC with MII/RMII Interfaces
  • 4 Dedicated DMA Channel for USB OTG
  • 5 Stage pipeline, Harvard architecture
  • MIPS16e mode for up to 40% smaller code size
  • Single cycle multiply and hardware divide unit
  • 32 x 32-bit Core Registers
  • 32 x 32-bit Shadow Registers
  • Fast context switch and interrupt response
  • 512K Flash (plus 12K boot Flash)
  • 64K RAM (can execute from RAM)
  • 8 Channel Hardware DMA Controller
  • Flash prefetch module with 256 Byte cache
  • Lock instructions or data in cache for fast access
  • Programmable vector interrupt controller
  • Fast and Accurate 16 channel 10-bit ADC,
  • Max 1 Mega samples per second at +/- 1LSB, conversion available during SLEEP & IDLE
  • RUN, IDLE, and SLEEP modes
  • Multiple switchable clock modes for each power mode, enables optimum power settings
  • 8 hardware breakpoints (6 Instruction and 2 Data)
  • 2 wire programming and debugging interface
  • JTAG interface supporting Programming, Debugging and Boundary scan
  • Fail-Safe Clock Monitor – allows safe shutdown if clock fails
  • Hardware RTCC (Real-Time Clock and Calendar with Alarms)
  • 2 Internal oscillators (8MHz & 31KHz)
  • Watchdog Timer with separate RC oscillator
  • Pin compatible with 16-bit PIC® MCUs
  • Serial Communication Modules allow flexible UART/SPI/I2C™ configuration
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

                                                                       

Additional Features

      MCU Core

      • 80MHz/105DMIPS, 32-bit MIPS M4K Core
      • USB 2.0 On-The-Go Peripheral with integrated PHY
      • 10/100 Ethernet MAC with MII/RMII Interfaces
      • 4 Dedicated DMA Channel for USB OTG
      • 5 Stage pipeline, Harvard architecture
      • MIPS16e mode for up to 40% smaller code size
      • Single cycle multiply and hardware divide unit
      • 32 x 32-bit Core Registers
      • 32 x 32-bit Shadow Registers
      • Fast context switch and interrupt response

      MCU System Features

      • 512K Flash (plus 12K boot Flash)
      • 64K RAM (can execute from RAM)
      • 8 Channel Hardware DMA Controller
      • Flash prefetch module with 256 Byte cache
      • Lock instructions or data in cache for fast access
      • Programmable vector interrupt controller

      Analog Features

      • Fast and Accurate 16 channel 10-bit ADC,
      • Max 1 Mega samples per second at +/- 1LSB, conversion available during SLEEP & IDLE

      Power Management Modes

      • RUN, IDLE, and SLEEP modes
      • Multiple switchable clock modes for each power mode, enables optimum power settings

      Debug Features

      • 8 hardware breakpoints (6 Instruction and 2 Data)
      • 2 wire programming and debugging interface
      • JTAG interface supporting Programming, Debugging and Boundary scan

      Other MCU Features

      • Fail-Safe Clock Monitor – allows safe shutdown if clock fails
      • Hardware RTCC (Real-Time Clock and Calendar with Alarms)
      • 2 Internal oscillators (8MHz & 31KHz)
      • Watchdog Timer with separate RC oscillator
      • Pin compatible with 16-bit PIC® MCUs
      • Serial Communication Modules allow flexible UART/SPI/I2C™ configuration
Parametrics
Name
Value
Part Family
PIC32MX6xx
Max CPU Speed MHz
80
Program Memory Size (KB)
512
SRAM (KB)
128
Auxiliary Flash (KB)
12
Temperature Range (C)
-40 to 105
Operating Voltage Range (V)
2.3 to 3.6
Direct Memory Access Channels
8
SPI
3
I2C
4
Ethernet
10/100 Base-TX Mac
Number of Ethernet Ports
1
Number of USB Modules
1
USB Interface
FS Device/Host/OTG
ADC Input
16
Max ADC Resolution (Bits)
10
Max ADC Sampling Rate (ksps)
1000
Input Capture
5
Standalone Output Compare/Standard PWM
5
Max 16-bit Digital Timers
5
Parallel Port
PMP
Number of Comparators
2
Internal Oscillator
8 MHz, 32 kHz
Max I/O Pins
53
Pincount
64

Documents

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Data Sheet

Programming Specification

Application Notes

Download All
01/16/2012
463KB

Reference Manual

Download All
04/03/2018
357KB

BSDL Files

09/28/2012
173KB

Design Guides

08/09/2010
50KB

IBIS

Brochures

Development Environment

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC32MX675F512H-80I/PT
0.286700
2.487500
64
TQFP
10x10x1mm
Matte Tin
e3
PIC32MX675F512H-80V/PT
0.286700
2.487500
64
TQFP
10x10x1mm
Matte Tin
e3
PIC32MX675F512HT-80I/PT
0.286700
0.574667
64
TQFP
10x10x1mm
Matte Tin
e3
PIC32MX675F512HT-80V/PT
0.286700
0.574667
64
TQFP
10x10x1mm
Matte Tin
e3
PIC32MX675F512H-80I/MR
0.232400
0.350000
64
QFN
9x9x0.9mm
Matte Tin
e3
PIC32MX675F512H-80V/MR
0.232400
0.350000
64
QFN
9x9x0.9mm
Matte Tin
e3
PIC32MX675F512HT-80I/MR
0.232400
0.370303
64
QFN
9x9x0.9mm
Matte Tin
e3
PIC32MX675F512HT-80V/MR
0.232400
0.370303
64
QFN
9x9x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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