Microchip Technology Inc
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23K256

2.7-3.6V 256Kb SPI Serial SRAM

Status: In Production

Features:

  • Max. Clock 20 MHz
  • Low-Power CMOS Technology: -- Read Current: 3 mA at 1 MHz -- Standby Current: 4 µA Max. at 3.6V
  • 32,768 x 8-bit Organization
  • 32-Byte Page
  • HOLD pin
  • Flexible Operating modes: -- Byte read and write -- Page mode (32 Byte Page) -- Sequential mode
  • Sequential Read/Write
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The Microchip Technology Inc. 23X256 are 256 Kbit Serial SRAM devices. The memory is accessed via a simple Serial Peripheral Interface (SPI) compatible serial bus. The bus signals required are a clock input (SCK) plus separate data in (SI) and data out (SO) lines. Access to the device is controlled through a Chip Select (CS) input. Communication to the device can be paused via the hold pin (HOLD). While the device is paused, transitions on its inputs will be ignored, with the exception of Chip Select, allowing the host to service higher priority interrupts. The 23X256 is available in standard packages including 8-lead PDIP and SOIC, and advanced packaging including 8-lead TSSOP.

Additional Features
  • Max. Clock 20 MHz
  • Low-Power CMOS Technology:     -  Read Current: 3 mA at 1 MHz     -  Standby Current: 4 µA Max. at 3.6V
  • 32,768 x 8-bit Organization
  • 32-Byte Page
  • HOLD pin
  • Flexible Operating modes:     -  Byte read and write     -  Page mode (32 Byte Page)     -  Sequential mode
  • Sequential Read/Write
Parametrics
Name
Value
Density
256K bits
Op. Volt Range (V)
2.7 to 3.6
Max. Clock Freq.
20 MHz
Page Size (bytes)
32
Temp Range (°C)
-40°C to +125°C
Endurance
Unlimited
Bus Modes
SPI

Documents

Jump to:

Brochures

IBIS

01/29/2013
91KB

Product Selection Tools

Sell Sheets

Verilog

Video

07/20/2009
27276KB

Webinars

01/27/2010
26649KB

Development tools data is currently unavailable.

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
23K256-E/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
23K256-I/P
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
23K256T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
23K256-I/SN
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
23K256-E/SN
0.078000
0.160000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
23K256T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
23K256T-I/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
23K256-E/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
23K256T-E/ST
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
23K256-I/ST
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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