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dsPIC33FJ64GP802

Status: In Production

Features:

  • Up to 40 MIPS operation (at 3.0-3.6V)
  • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
  • Single-cycle multiply and accumulate (MAC) with accumulator write back and dual data fetch
  • On-chip 2.5V voltage regulator
  • 10-bit, 11 Msps or 12-bit, 500 Ksps conversion:
  • Enhanced CAN (ECAN) module (1 Mbaud) with 2.0B support
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

 •dsPIC33Fs are designed to execute digital filter algorithms and high-speed precision digital control loops, ideal for applications that need to perform under pressure           •General Purpose Digital Signal Controllers (DSCs) with advanced analog and seamless migration options to PIC24F, PIC24H MCUs and dsPIC30F DSCs 

Additional Features
  • Operating Range
    • Up to 40 MIPS operation (at 3.0-3.6V)
    • 3.0V to 3.6V, -40ºC to +150ºC, DC to 20 MIPS
    • 3.0V to 3.6V, -40ºC to +125ºC, DC to 40 MIPS
  • High-Performance dsPIC33FJ core
    • Modified Harvard architecture
    • C compiler optimized instruction set
    • 24-bit wide instructions, 16-bit wide data path
    • Linear program memory addressing up to 4M instruction words
    • Linear data memory addressing up to 64 Kbytes
    • Two 40-bit accumulators with rounding and saturation options
    • Indirect, Modulo and Bit-reversed addressing modes
    • 16 x 16 fractional/integer multiply operations
    • 32/16 and 16/16 divide operations
    • Single-cycle multiply and accumulate (MAC) with accumulator write back and dual data fetch
    • Single-cycle MUL plus hardware divide
    • Up to ±16-bit shifts for up to 40-bit data
    • On-chip Flash and SRAM
  • Direct Memory Access (DMA)
    • 8-channel hardare DMA
    • Up to 2 Kbytes dual ported DMA buffer area (DMA RAM) to store data transferred via DMA
    • Most peripherals support DMA
  • Timers/Capture/Compare/PWM
    • Up to five 16-bit and up to two 32-bit Timers/Counters
    • One timer runs as a Real-Time Clock with an external 32.768 kHz oscillator
    • Input Capture (up to four channels) with Capture on up, down or both edges
    • 16-bit capture input functions
    • 4-deep FIFO on each capture
    • Output Compare (up to four channels) with Single or Dual 16-bit Compare mode and 16-bit Glitchless PWM mode
    • Hardware Real-Time Clock/Calendar (RTCC)
  • Interrupt Controller
    • 5-cycle latency
    • 118 interrupt vectors
    • Up to 49 available interrupt sources
    • Up to three external interrups
    • Seven programmable priority levels
    • Five processor exceptions
  • Digital I/O
    • Peripheral pin Select functionality
    • Up to 35 programmable digital I/O pins
    • Wake-up/Interrupt-on-Change for up to 21 pins
    • Output pins can drive from 3.0V to 3.6V
    • Up to 5V output with open drain configuration
    • All digital input pins are 5V tolerant
    • 4 mA sink on all I/O pins
  • System Management
    • Flexible clock options: External, crystal, resonator and internal RC
    • Fully integrated Phase-Locked Loop (PLL)
    • Extremely low jitter PLL
    • Power-up Timer
    • Oscillator Start-up Timer/Stabilizer
    • Watchdog Timer with its own RC oscillator
    • Fail-Safe Clock Monitor
    • Reset by multiple sources
  • Power Management
    • On-chip 2.5V voltage regulator
    • Switch between clock sources in real time
    • Idle, Sleep, and Doze modes with fast wake-up
  • Analog-to-Digital Converters (ADCs)
    • 10-bit, 11 Msps or 12-bit, 500 Ksps conversion:
    • Two and four simultaneous samples (10-bit ADC)
    • Up to 13 input channels with auto-scanning
    • Conversion start can be manual or synchronized with one of four trigger sources
    • Conversion possible in Sleep mode
    • ±2 LSb max integral nonlinearity
    • ±1 LSb max differential nonlinearity
  • Other Analog Peripherals
    • Two analog comparators with programmable input/output configuration
    • 4-bit DAC with two ranges for analog comparators
    • 16-bit dual channel 100 Ksps audio DAC
  • Data Converter Interface (DCI) module
    • Codec interface
    • Supports I2S and AC.97 protocols
    • Up to 16-bit data words, up to 16 words per frame
    • 4-word deep TX and RX buffers
  • Communication Modules
    • 4-wire SPI (up to two modules) with I/O interface to simple codecs
    • I2C™ with Full Multi-Master Slave mode support, slave address masking, 7-bit and 10-bit addressing, integrated signal conditioning and bus collision detection
    • UART (up to two modules) with LIN bus support, IrDA® and hardware flow control with CTS and RTS
    • Enhanced CAN (ECAN) module (1 Mbaud) with 2.0B support
    • Parallel Master Slave Port (PMP/EPSP)
    • Programmable Cyclic Redundancy Check (CRC)
  • Debugger Development Support
    • In-circuit and in-application programming
    • Two program breakpoints
    • Trace and run-time watch
Parametrics
Name
Value
Architecture
16-bit
Max CPU Speed (MHz)
40
CPU Speed (MIPS/DMIPS)
40
Program Memory Size (KB)
64
SRAM (KB)
16
Direct Memory Access Channels
8
Temperature Range (C)
-40 to 150
Operating Voltage Range (V)
3 to 3.6
Pin Count
28
Comparators
2
Analog Peripherals
1-A/D 10x12-bit @ 1100(ksps) 2-D/A 2x16-bit
UART
2
SPI
2
I2C
1
Timers
5 x 16-bit 2 x 32-bit
Input Capture
4
Max PWM outputs (including complementary)
4
Number of PWM Time Bases
2
Output Compare Channels
4
Number of CAN Modules
1
Type of CAN Module
CAN
Class B Hardware
Yes
Peripheral Pin Select / Pin Muxing
Yes

Documents

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03/18/2014
668KB
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Development Environment

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  • Code Examples
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Debug Features:
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Programmers
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  • Socket: AC164337   PartNo: DSPIC33FJ64GP802 (28SP)
  • Socket: AC164339   PartNo: DSPIC33FJ64GP802 (28SO)
  • Socket: AC164336   PartNo: DSPIC33FJ64GP802 (28MM)
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Software Libraries
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
DSPIC33FJ64GP802-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ64GP802T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ64GP802-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ64GP802T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ64GP802-H/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ64GP802T-H/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ64GP802-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
DSPIC33FJ64GP802-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
DSPIC33FJ64GP802-H/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ64GP802T-H/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ64GP802T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ64GP802-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ64GP802T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ64GP802-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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