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TC4627

Non-Inverting Power CMOS Driver with Voltage Tripler

Status: In Production

Features:

  • Power driver with on Board Voltage Booster
  • Low IDD: < 4mA
  • Small Package: 8-Pin PDIP
  • Under-Voltage Circuitry
  • Fast Rise-Fall Time: < 40nsec @ 1000pF
  • Below-Rail Input Protection
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The TC4626/4627 are single CMOS high speed drivers with an on-board voltage boost circuit. These parts work with an input supply voltage from 4 to 6 volts. The internal voltage booster will produce a VBOOST potential up to 12 volts above VIN. This VBOOST is not regulated, so its voltage is dependent on the input VDD voltage and output drive loading requirements. An internal undervoltage lockout circuit keeps the output in a low state when VBOOST drops below 7.8 volts.Output is enabled when VBOOST is above 11.3 volts.

Additional Features
    • Power driver with on Board Voltage Booster
    • Low IDD: < 4mA
    • Small Package: 8-Pin PDIP
    • Under-Voltage Circuitry
    • Fast Rise-Fall Time: < 40nsec @ 1000pF
    • Below-Rail Input Protection
Parametrics
Name
Value
MOSFET Driver Type
Low Side
Driver Type
Single
Configuration
Non-inverting
Peak Output Current (source/sink, A)
1.5/1.5
Output Resistance (source/sink, Ω)
10/8
Maximum Supply Voltage (V)
6
Propagation Delay (Td1/Td2, ns)
35/45
Rise/Fall Time (Tr/Tf, ns)
33/27
Capacitive Load Drive
1000 pF in 40 ns
Features
Boosted drive voltage

Documents

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Data Sheet

08/07/2014
772KB

Product Line Card

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board
8-Pin SOIC/MSOP/TSSOP/DIP Evaluation Board ( SOIC8EV )

This is a blank PCB that allows the operation of Microchip Technology’s 8-pin devices to be easily evaluated. Each device pin is connected to a pull-up resistor, a pull-down resistor, an in-line resistor, and a loading capacitor. The PCB pads allow through hole or surface mount connectors to be installed to ease connection to the board. Additional passive component footprints are on the...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
TC4627COE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
TC4627COE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
TC4627EOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
TC4627EOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
TC4627MJA
1.022410
0.800000
8
CERDIP
.300in
SAC
e1
TC4627CPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
TC4627EPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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