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MCP2150

IrDA® Standard Protocol Stack Controller Supporting DTE Applications

Status: In Production

Features:

  • IrLAP
  • IrLMP
  • IAS
  • TinyTP
  • IrCOMM (9-wire "cooked" service class)
  • Bidirectional communication
  • CRC implementation
  • Data communication rates up to 115.2 kbaud
  • Easily interfaces with Industry standard UARTs and infrared transceivers
  • UART interface for connecting to Data Terminal Equipment (DTE) systems
  • Transmit/Receive formats (bit width) supported: 1.63 µs
  • 9.6 kbaud
  • 19.2 kbaud
  • 57.6 kbaud
  • 115.2 kbaud
  • 9.6 kbaud
  • 19.2 kbaud
  • 38.4 kbaud
  • 57.6 kbaud
  • 115.2 kbaud
  • 64 Byte Data Packet Size
  • Programmable Device ID String
  • Operates as Secondary Device
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The MCP2150 is a cost effective, low pin count (18-pin), easy to use device for implementing IrDA standard wireless connectivity. The MCP2150 provides support for the IrDA standard protocol “stack” plus bit encoding/decoding.

The serial interface baud rates are user selectable to one of four IrDA standard baud rates between 9600 baud and 115.2 kbaud (9600, 19200, 57600, 115200). The IR baud rates are user selectable to one of five IrDA standard baud rates between 9600 baud and 115.2 kbaud (9600, 19200, 37400, 57600, 115200). The serial interface baud rate will be specified by the BAUD1: BAUD0 pins, while the IR baud rate is specified by the Primary Device (during Discover phase). This means that the baud rates do not need to be the same. The MCP2150 operates in Data Terminal Equipment (DTE) applications and sits between a UART and aninfrared optical transceiver.

The MCP2150 encodes an asynchronous serial data stream, converting each data bit to the corresponding infrared (IR) formatted pulse. IR pulses received are decoded and then handled by the protocol handler state machine. The protocol handler sends the appropriate data bytes to the Host Controller in UART formatted serial data.

The MCP2150 supports “point-to-point” applications. That is, one Primary device and one Secondary device. The MCP2150 operates as a Secondary device. It does not support “multi-point” applications.

Sending data using IR light requires some hardware and the use of specialized communication protocols. These protocol and hardware requirements are described, in detail, by the IrDA standard specifications. The encoding/decoding functionality of the MCP2150 is designed to be compatible with the physical layer component of the IrDA standard. This part of the standard is often referred to as “IrPHY”.

The complete IrDA standard specifications are available for download from the IrDA website (www.IrDA.org).

 

 

 

Additional Features
    • Implements the IrDA® standard including:
      • IrLAP
      • IrLMP
      • IAS
      • TinyTP
      • IrCOMM (9-wire "cooked" service class)
    • Provides IrDA standard physical signal layer support including:
      • Bidirectional communication
      • CRC implementation
      • Data communication rates up to 115.2 kbaud
    • Includes UART to IrDA standard encoder/decoder functionality:
      • Easily interfaces with Industry standard UARTs and infrared transceivers
    • UART interface for connecting to Data Terminal Equipment (DTE) systems
    • Transmit/Receive formats (bit width) supported: 1.63 µs
    • Hardware baud rate selection for UART:
      • 9.6 kbaud
      • 19.2 kbaud
      • 57.6 kbaud
      • 115.2 kbaud
    • Infrared baud rates supported:
      • 9.6 kbaud
      • 19.2 kbaud
      • 38.4 kbaud
      • 57.6 kbaud
      • 115.2 kbaud
    • 64 Byte Data Packet Size
    • Programmable Device ID String
    • Operates as Secondary Device
Parametrics
Name
Value
Operating Temperature Range (°C)
-40°C to +85°C
Xmit/Rec Formats supported (µS)
1.63
Max. Baud Rate
115200.0
Operating Voltage (V)
3.0 - 5.5
Device Description
IrDA Protocol Stack handler plus bit encoding/decoding for DTE applications

Documents

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Data Sheet

02/05/2013
952KB

Product Line Card


Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP2150-I/SS
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2150-I/SSRVB
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2150T-I/SS
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2150T-I/SSRVB
0.164200
0.416250
20
SSOP
.209in
Matte Tin
e3
MCP2150-I/SSGRVB
0.164200
0.343284
20
SSOP
.209in
Matte Tin
e3
MCP2150T-I/SSGRVB
0.164200
0.476875
20
SSOP
.209in
Matte Tin
e3
MCP2150-I/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
MCP2150-I/SORVB
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
MCP2150T-I/SO
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
MCP2150T-I/SORVB
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
MCP2150-I/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
MCP2150-I/PRVB
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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