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24C64

Status: End of Life

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RoHS Information
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Device Overview

Please consider this device 24LC64

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01/27/2010
31187KB
01/27/2010
38593KB
01/27/2010
33683KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
AT24C64AN-10SQ-2.7-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
AT24C64B-10TQ-2.7-T
0.033000
0.215600
8
TSSOP
4.4mm
Matte Tin
e3
AT24C64D-SSHM-T-899
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
AT24C64D-XPD-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
AT24C64D-MAHM-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
AT24C64D-MAPD-E
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
AT24C64D-MAPD-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
AT24C64D-SSPD-T
0.075000
0.250000
8
SOIC
3.90mm(.150in)
NiPdAu
e4
AT24C64D-XHM-B
0.035800
0.190000
8
TSSOP
4.4mm
NiPdAu
e4
AT24C64D-XHM-T
0.035800
0.199200
8
TSSOP
4.4mm
NiPdAu
e4
AT24C64B-10TU-2.7
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
AT24C64B-10TU-1.8
0.033000
0.090000
8
TSSOP
4.4mm
Matte Tin
e3
AT24C64D-MAHM-T
0.009600
0.084000
8
UDFN
2x3x0.6mm
NiPdAu
e4
AT24C64D-SSHM-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
AT24C64BN-10SU-1.8-T
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
AT24C64BN-10SU-2.7
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
AT24C64D-SSHM-B
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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