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PIC16C66

Status: Not Recommended for new designs

Features:

  • A newer device is available. Please consider PIC16F76.
View More
Overview
Documents
Development Environment
Similar Devices
RoHS Information
Add To Cart

Device Overview

Please consider this device PIC16F76

Additional Features
A newer device is available. Please consider PIC16F76.
Parametrics
Name
Value
Program Memory Type
OTP
Program Memory Size (KB)
14
CPU Speed (MIPS/DMIPS)
5
SRAM (KB)
368
Digital Communication Peripherals
1-UART,
Capture/Compare/PWM Peripherals
2 CCP,
Timers
2 x 8-bit, 1 x 16-bit
Temperature Range (°C)
-40 to 85
Operating Voltage Range (V)
2.5 to 6
Pin Count
28

Documents

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Data Sheets

  
6121KB

Supporting Collateral

White Papers

Reference Manuals

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95KB

Development Environment

  • Integrated Development Environments
  • Programmers
  • Code Examples
Integrated Development Environments
MPLAB-X-IDE
MPLAB X Integrated Development Environment (IDE) ( MPLAB-X-IDE )

MPLAB® X Integrated Development Environment (IDE) is an expandable, highly configurable software program that incorporates powerful tools to help you discover, configure, develop, debug and qualify embedded designs for most of Microchip’s microcontrollers, microprocessors and digital signal controllers.
MPLAB X IDE works seamlessly with the MPLAB development ecosystem of

...

Learn More
Programmers
MPLAB PM3 Universal Device Programmer
MPLAB PM3 Universal Device Programmer ( DV007004 )

The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

  • Socket: AC164302   PartNo: PIC16C66 (28SO)
  • Socket: AC164301   PartNo: PIC16C66 (28SP)
Learn More
Add To Cart

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Flash (KB)
RAM (B)
Price 5K
Notes
28
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28
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28
14
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28
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28
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$5.14
 
28
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$3.73
 
40
7
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$6.22
 
40
7
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28
14
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$4.73
 
40
14
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$5.07
 
28
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40
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC16C662-04/L
2.375500
3.703704
44
PLCC
16.6x16.6x4.4mm
Matte Tin
e3
PIC16C66-04/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC16C66-04I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC16C66-10/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC16C66-10I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC16C66-20/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC16C66-20I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
PIC16C662-04I/P
6.500000
10.600000
40
PDIP
.600in
Matte Tin
e3
PIC16C66-04/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC16C66-20/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC16C66-20I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
PIC16C66-04I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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