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dsPIC33FJ12GP

Status: New Device Entry

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
DSPIC33FJ12GP202-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ12GP202-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ12GP202T-E/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ12GP202T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
DSPIC33FJ12GP202-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
DSPIC33FJ12GP202-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
DSPIC33FJ12GP202T-E/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
DSPIC33FJ12GP202T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
DSPIC33FJ12GP201-E/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
DSPIC33FJ12GP201-I/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
DSPIC33FJ12GP202-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ12GP202-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ12GP202T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ12GP202T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
DSPIC33FJ12GP201-E/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
DSPIC33FJ12GP201-I/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
DSPIC33FJ12GP202-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
DSPIC33FJ12GP202-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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