Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
product primary image

USB5534

Status: In Production

Features:

  • Two, three, or four downstream USB 3.0 ports (which also support USB 2.0)
  • Three additional USB 2.0 ports for non-removable devices (USB5537B only)
  • Designed for low-power operation and low thermal dissipation
  • On-chip 8051 µC manages GPIOs, VBUS, and other hub signals
  • Configuration via on-chip programmable ROM, SPI ROM or SMBus
  • Manufacturing line and field update capabilities
  • Power management capability on GPIO/LED pins
  • One-Time Programmable (OTP) ROM (8 kbit), including on-chip charge pump
  • IETF RFC 4122 compliant 128-bit UUID
  • Compatible with Microsoft® Windows® 8 and other major OS’s
  • Multi-color LED scheme shows port capability and speed
  • Embedded 8051 microcontroller for hub configuration
  • 64-pin, low-cost QFN packages enable 2-layer PCB design
  • Expansion Hubs
  • Docking Stations
  • LCD Monitors
  • HDTVs
  • AV Equipment
  • Automotive Head End Units (HEUs)
  • Industrial Products
View More
Overview
Documents
Development Environment
Similar Devices
RoHS Information
Add To Cart

Device Overview

Summary

Microchip's USB553xB hub controllers are 2/3/4/7-port, SuperSpeed (SS)/Hi-Speed (HS), low-power, configurable and fully-compliant with the USB 3.0 specification. The USB553xB also support Full Speed (FS) and Low Speed (LS) USB signaling, offering complete coverage of all defined USB operating speeds. The new SuperSpeed hub controller (available on 4 of the 7 ports for the USB5537B) operates in parallel with the USB 2.0 controller, so 5Gbps SuperSpeed data transfers are not affected by slower USB 2.0 traffic.


*The USBCheck online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.

Additional Features

    Highlights

    • Two, three, or four downstream USB 3.0 ports (which also support USB 2.0)
    • Three additional USB 2.0 ports for non-removable devices (USB5537B only)
    • Designed for low-power operation and low thermal dissipation
    • On-chip 8051 µC manages GPIOs, VBUS, and other hub signals
    • Configuration via on-chip programmable ROM, SPI ROM or SMBus
    • Manufacturing line and field update capabilities
    • Power management capability on GPIO/LED pins
    • One-Time Programmable (OTP) ROM (8 kbit), including on-chip charge pump
    • IETF RFC 4122 compliant 128-bit UUID
    • Compatible with Microsoft® Windows® 8 and other major OS’s
    • Microchip’s TrueSpeed LEDs (configuration dependent)
      • Multi-color LED scheme shows port capability and speed
    • Embedded 8051 microcontroller for hub configuration
    • 64-pin, low-cost QFN packages enable 2-layer PCB design

    Target Applications

    • Expansion Hubs
    • Docking Stations
    • LCD Monitors
    • HDTVs
    • AV Equipment
    • Automotive Head End Units (HEUs)
    • Industrial Products
Parametrics
Name
Value
Upstream Port
USB 3.0
USB Speed
Super Speed
Downstream Ports
4
MGMT I/F
I2C
ROM I/F
SPI
Op Voltage (V)
3.3
MultiTRAK Tech
Yes
PortMap
Yes
PortSwap
Yes
TrueSpeed
Yes
PHYBoost
Yes
Temp. Range Max.
70

Documentation data is currently unavailable.


Development tools data is currently unavailable.

Similar Devices

Product
Price 5K
$1.31
$1.03
$1.71
$2.29
$2.52
$2.52
$4.04
$1.55
$1.09
 
$1.41
$1.97
$1.45
$3.17
$3.02
$1.97
$2.56
$2.63
$1.80
$2.70
$1.80
$2.70
$2.89
$2.85
 
$3.54
$3.71
 
$4.17
$4.84
$4.17
$3.10
$3.44
$5.16
$5.16
$5.04
$5.04
$5.40
$5.40
$5.76
$5.16
$5.40
$5.76
$4.78
$5.35
$5.20
$5.07
$5.63
$5.65
 

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
USB5534B-5000JZX
0.232400
1.634615
64
QFN
9x9x0.9mm
Matte Tin
e3
USB5534B-5000JZXTR
0.232400
0.200000
64
QFN
9x9x0.9mm
Matte Tin
e3
USB5534B-6080JZX
0.232400
1.634615
64
QFN
9x9x0.9mm
Matte Tin
e3
USB5534B-6080JZXTR
0.232400
0.200000
64
QFN
9x9x0.9mm
Matte Tin
e3
USB5534B-4100JZX
0.232400
1.634615
64
QFN
9x9x0.9mm
Matte Tin
e3
USB5534B-4100JZXTR
0.232400
0.200000
64
QFN
9x9x0.9mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

Buy from Microchip

Grid
View
Table
View
Filter:
Apply
Clear
Only show products with samples
Product
Leads
Package Type
Temp Range
Packing Media
5K Pricing
Buy