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SST26WF016B

16Mb 1.65-1.95V Serial Quad I/O (SQI) Flash

Status: In Production

Features:

  • Serial Interface Architecture: Nibble-wide multiplexed I/O’s with SPI-like serial command structure
  • Mode 0 and Mode 3
  • x1/x2/x4 Serial Peripheral Interface (SPI) Protocol -Burst Modes
  • Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
  • Page-Program: 256 Bytes per page in x1 or x4 mode
  • Flexible Erase Capability: Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
  • Software Write Protection: Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
  • Low Power Consumption: Active Read current: 15 mA (typical at 104 MHz), Standby Current: 10 µA (typical)
  • SFDP (Serial Flash Discoverable Parameters)
  • Packages Available: 8-contact WSON (6mm x 5mm), 8-lead SOIC (150 mil), 8-ball XFBGA (Z-Scale)
  • All devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
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Device Overview

Summary

The SST26WF016B Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial flash devices. SST26WF016B also supports full command-set compatibility to traditional Serial Peripheral Interface (SPI) protocol. Operating at frequencies reaching 104 MHz, the SST26WF016B enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM. The SST26WF016B writes (Program or Erase) with a single power supply of 1.65-1.95V and significantly lower power consumption. The device’s low power consumption makes it the ideal choice for Mobile handset, Bluetooth, GPS, camera module, table, hearing aid and any battery powered devices. Further benefits are achieved with SST’s proprietary, high-performance CMOS SuperFlash® technology, which significantly improves performance and reliability.

The SST26WF016B default at power up is with WP# and HOLD pins enable and SIO2 and SIO3 pins disable allowing for SPI protocol operations without register configuration.
The SST26WF016BA default at power up is with WP# and HOLD pins disable and SIO2 and SIO3 pins enable allowing for Quad I/O operations without register configuration.

Additional Features
    • Serial Interface Architecture: Nibble-wide multiplexed I/O’s with SPI-like serial command structure
    • Mode 0 and Mode 3
    • x1/x2/x4 Serial Peripheral Interface (SPI) Protocol -Burst Modes
    • Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
    • Page-Program: 256 Bytes per page in x1 or x4 mode
    • Flexible Erase Capability: Uniform 4 KByte sectors, Four 8 KByte top and bottom parameter overlay blocks, One 32 KByte top and bottom overlay block, Uniform 64 KByte overlay blocks
    • Software Write Protection: Individual Block-Locking: 64 KByte blocks, two 32 KByte blocks, and eight 8 KByte parameter blocks
    • Low Power Consumption: Active Read current: 15 mA (typical at 104 MHz), Standby Current: 10 µA (typical)
    • SFDP (Serial Flash Discoverable Parameters)
    • Packages Available: 8-contact WSON (6mm x 5mm), 8-lead SOIC (150 mil), 8-ball XFBGA (Z-Scale)
    • All devices are RoHS compliant
Parametrics
Name
Value
Density
16 Mbit
Op. Volt Range (V)
1.65 to 1.95
Max. Clock Freq.
104 MHz
Page Size (bytes)
256
Write Protect
Full Array
Temp Range (°C)
-40°C to +85°C
Endurance
100,000
Data Retention (Years)
100
Bus Modes
SPI,SDI,SQI

Documents

Jump to:

Board Design Files

Brochures

12/19/2017
3698KB

Code Examples

Software Libraries/Firmware

12/12/2017
542KB

Development Environment

  • Demo & Evaluation Boards
  • Code Examples
Demo & Evaluation Boards
SQI SuperFlash(R) Kit 1
SQI SuperFlash(R) Kit 1 ( AC243009 )

The SQI SuperFlash Kit 1 contains three Serial Flash Daughter Boards. The Serial Flash Daughter Board is an evaluation board designed to interface with the mikroBUS™ connector on the Explorer 16/32 Development Board (DM240001-2). It can also interface with the PICtail™ Plus connector that is located on the Explorer 16 Development Board (DM240001).

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST26WF016BT-104I/CS
0.005000
0.050333
8
CSP
Varies
SAC
e1
SST26WF016BAT-104I/CS
0.005000
0.050333
8
CSP
Varies
SAC
e1
SST26WF016B-104I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST26WF016BA-104I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST26WF016BAT-104I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST26WF016BT-104I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
SST26WF016B-104I/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26WF016BAT-104I/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26WF016BT-104I/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26WF016BA-104I/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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