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SST26VF032

Status: Not Recommended for new designs

Features:

  • Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure: Mode 0 and Mode 3- Single-bit, SPI backwards compatible: Read, Fast Read, and JEDEC ID Readit/s sustained data rate
  • Continuous Linear Burst Modes– 8/16/32/64 Byte linear burst with wrap-around
  • Low Power Consumption:– Active Read current: 12 mA (typical @ 80 MHz)– Standby Current: 8 µA (typical)
  • Fast Erase and Byte-Program:– Chip-Erase time: 35 ms (typical)– Sector-/Block-Erase time: 18 ms (typical)
  • Page-Program– 256 Bytes per page– Fast Page Program time in 1 ms (typical)
  • Flexible Erase Capability– Uniform 4 KByte sectors– Four 8 KByte top and bottom parameter overlay blocks– Two 32 KByte top and bottom overlay blocks– Uniform 64 KByte overlay blocks - 62 Blocks
  • Software Write Protection– Individual Block-Locking- 64 KByte blocks, two 32 KByte blocks, and eight 8
  • Packages Available– 8-contact WSON (6mm x 5mm)– 8-lead SOIC (200 mil)
  • All devices are RoHS compliant
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Overview
Documents
Development Environment
Similar Devices
RoHS Information
Add To Cart

Device Overview

Summary

The SST26VF032 Serial Quad I/O (SQI) flash device utilizes a 4-bit multiplexed I/O serial interface to boost performance while maintaining the compact form factor of standard serial flash devices. Operating at frequencies reaching 80 MHz, the SST26VF032 enables minimum latency execute-in-place (XIP) capability without the need for code shadowing on an SRAM. The device’s high performance and small footprint make it the ideal choice for mobile handsets, Bluetooth® headsets, optical disk drives, GPS applications and other portable electronic products. Further benefits are achieved with SST’s proprietary, high-performance CMOS SuperFlash® technology, which significantly improves performance and reliability, and lowers power consumption for high bandwidth, compact designs.

Please consider this device SST26VF032B

Additional Features
    • Serial Interface Architecture- Nibble-wide multiplexed I/O’s with SPI-like serial command structure: Mode 0 and Mode 3- Single-bit, SPI backwards compatible: Read, Fast Read, and JEDEC ID Readit/s sustained data rate
    • Continuous Linear Burst Modes– 8/16/32/64 Byte linear burst with wrap-around
    • Low Power Consumption:– Active Read current: 12 mA (typical @ 80 MHz)– Standby Current: 8 µA (typical)
    • Fast Erase and Byte-Program:– Chip-Erase time: 35 ms (typical)– Sector-/Block-Erase time: 18 ms (typical)
    • Page-Program– 256 Bytes per page– Fast Page Program time in 1 ms (typical)
    • Flexible Erase Capability– Uniform 4 KByte sectors– Four 8 KByte top and bottom parameter overlay blocks– Two 32 KByte top and bottom overlay blocks– Uniform 64 KByte overlay blocks - 62 Blocks
    • Software Write Protection– Individual Block-Locking- 64 KByte blocks, two 32 KByte blocks, and eight 8
    • Packages Available– 8-contact WSON (6mm x 5mm)– 8-lead SOIC (200 mil)
    • All devices are RoHS compliant
Parametrics
Name
Value
Density
32 Mbit
Op. Volt Range (V)
2.7 to 3.6
Max. Clock Freq.
80 MHz
Page Size (bytes)
256
Temp Range (°C)
-40°C to +85°C
Endurance
100,000
Data Retention (Years)
100
Bus Modes
SPI,SQI

Documents

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Development Environment

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Integrated Development Environments
MPLAB-X-IDE
MPLAB X Integrated Development Environment (IDE) ( MPLAB-X-IDE )

MPLAB® X Integrated Development Environment (IDE) is an expandable, highly configurable software program that incorporates powerful tools to help you discover, configure, develop, debug and qualify embedded designs for most of Microchip’s microcontrollers, microprocessors and digital signal controllers.
MPLAB X IDE works seamlessly with the MPLAB development ecosystem of

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Programmers
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MPLAB PM3 Universal Device Programmer ( DV007004 )

The MPLAB® PM3 Universal Device Programmer is easy to use and operates with a PC or as a stand-alone unit, and programs Microchip's entire line of PIC® devices as well as the latest dsPIC® DSC devices. When used standalone, data can be loaded and saved with the SD/MMC card (not included).

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
SST26VF032-80-5I-S2AE
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032-80-5I-S2AE-T
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF032B-104I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032B-104V/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BA-104I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BT-104I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BT-104V/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BEUI-104I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BEUIT-104I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BAT-104I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF032B-104V/SM70SVAO
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BT-104V/SM70SVAO
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BA-104V/SM70SVAO
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
SST26VF032BT-104I/TD
0.336000
24
TBGA
6x8x1.2mm
SAC
e1
SST26VF032B-104I/TD
0.666667
24
TBGA
6x8x1.2mm
SAC
e1
SST26VF032-80-5I-QAE
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032B-104I/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032BA-104I/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032BAT-104I/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032BT-104I/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032BT-104V/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032B-104V/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
SST26VF032-80-5I-QAE-T
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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