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PIC12F529T39A

Status: In Production

Features:

  • Factory calibrated to ±1%
  • In-Circuit Serial Programming™ (ICSP™)
  • Power-on Reset (POR)
  • Device Reset Timer (DRT)
  • Watchdog Timer (WDT) with Dedicated On-Chip
  • Programmable Code Protection
  • Multiplexed MCLR Input Pin
  • Internal Weak Pull-ups on I/O Pins
  • Power-Saving Sleep mode
  • Wake-up from Sleep on Pin Change
  • INTRC: 4 MHz or 8 MHz precision internal RC oscillator
  • EXTRC: External low-cost RC oscillator
  • XT: Standard crystal/resonator
  • LP: Power-saving, low-frequency crystal
  • Fully Integrated Transmitter
  • FSK Operation up to 100 kbps
  • OOK Operation up to 10 kbps
  • Frequency-Agile Operation in 310, 433, 868 and 915 MHz Bands
  • Configurable Output Power: +10 dBm, 0 dBm
  • 225 nA @ 2.0V, RF Sleep, typical
  • 175 µA @ 4 MHz, 2.0V, RF Sleep, typical
  • 9.17 mA @ 4 MHz, 2.0V, RF on at +0 dBm, typical
  • 15.17 mA @ 4 MHz, 2.0V, RF on at +10 dBm, typical
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Overview
Documents
Development Environment
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RoHS Information
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Device Overview

Summary

PIC micro® with fully integrated RF Transmitter capable of operation in 310, 433, 868 and 915 MHz Bands.

Additional Features

    Special Microcontroller Features:

    • 8 MHz Precision Internal Oscillator:
      • Factory calibrated to ±1%
    • In-Circuit Serial Programming™ (ICSP™)
    • Power-on Reset (POR)
    • Device Reset Timer (DRT)
    • Watchdog Timer (WDT) with Dedicated On-Chip
    • RC Oscillator for Reliable Operation
    • Programmable Code Protection
    • Multiplexed MCLR Input Pin
    • Internal Weak Pull-ups on I/O Pins
    • Power-Saving Sleep mode
    • Wake-up from Sleep on Pin Change
    • Selectable Oscillator Options:
      • INTRC: 4 MHz or 8 MHz precision internal RC oscillator
      • EXTRC: External low-cost RC oscillator
      • XT: Standard crystal/resonator
      • LP: Power-saving, low-frequency crystal

    RF Transmitter:

    • Fully Integrated Transmitter
    • FSK Operation up to 100 kbps
    • OOK Operation up to 10 kbps
    • Frequency-Agile Operation in 310, 433, 868 and 915 MHz Bands
    • Configurable Output Power: +10 dBm, 0 dBm

    Low-Power Features/CMOS Technology:

    • Standby Current:
      • 225 nA @ 2.0V, RF Sleep, typical
    • Operating Current:
      • 175 µA @ 4 MHz, 2.0V, RF Sleep, typical
      • 9.17 mA @ 4 MHz, 2.0V, RF on at +0 dBm, typical
      • 15.17 mA @ 4 MHz, 2.0V, RF on at +10 dBm, typical
Parametrics
Name
Value
Program Memory Type
Flash
Program Memory Size (KB)
2.3
CPU Speed (MIPS/DMIPS)
2
SRAM Bytes
201
Data EEPROM/HEF (bytes)
64
Timers
1 x 8-bit
Temperature Range (C)
-40 to 85
Operating Voltage Range (V)
2 to 3.7
Pin Count
8

Documents

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Programming Specification

Product Brief

03/13/2012
154KB

Brochures

06/28/2012
1437KB

Development Environment

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Flash (KB)
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Notes
8
2.3
201
$0.95
 

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC12F529T39A-I/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
PIC12F529T39AT-I/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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