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MX575ABB

Status: In Production

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MX575ABB200M000
0.092400
0.116279
6
LLGA
7x5x1.4mm
NiAu
e4
MX575ABB200M000-TR
0.092400
0.536800
6
LLGA
7x5x1.4mm
NiAu
e4
MX575ABB25M0000-TR
0.092400
0.536800
6
LLGA
7x5x1.4mm
NiAu
e4
MX575ABB50M0000
0.092400
0.116279
6
LLGA
7x5x1.4mm
NiAu
e4
MX575ABB50M0000-TR
0.092400
0.536800
6
LLGA
7x5x1.4mm
NiAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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