Microchip Technology Inc
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MSL2166

Status: Not Recommended for new designs

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RoHS Information
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02/01/2012
1745KB

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01/01/2013
124KB

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RoHS Information

Part Number
Device Weight
Shipping Weight
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MSL2166-DUR
0.228200
0.057000
64
VQFN
9x9x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
MSL2166-DU
0.228200
0.876923
64
VQFN
9x9x0.9mm
Matte Tin
e3
Rohs icon
efup china icon
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Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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