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MCP14A015

Status: In Production

Features:

  • High Peak Output Current: 1.5 A (typical)
  • Wide Input Supply Voltage Operating Range: 4.5 V to 18 V
  • Low Shoot-Through/Cross-Conduction Current in Output Stage
  • 1000 pF in 11.5 ns (typical
  • Short Delay Times: 33 ns (tD1), 24 ns (tD2) (typical)
  • Low Supply Current: 375 μA (typical)
  • Low Voltage Threshold Input and Enable with Hysteresis: 1.2 to 1.6 V
  • Latch-Up Protected: Withstands 500 mA Reverse Current
  • 6L SOT-23
  • 6L 2x2 DFN
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The MCP14A0151 and MCP14A0152 are inverting and non-inverting, 1.5 A MOSFET drivers in 2x2 DFN and SOT-23 packages. These high-speed MOSFET drivers allow controllers and MCUs to quickly charge and discharge capacitive loads. The small package sizes allow the gate driver to be positioned close to the MOSFET's physical gate connection, which minimizes gate bounce caused by the parasitic effects of PCB layout and reduces EMI. Rise time, fall time, propagation delay and cross-conduction current are all minimized. In addition, these devices feature a unique architecture with low input thresholds, ideally suited for use with a low-voltage MCU to minimize power losses within the system.

Additional Features
    • High Peak Output Current: 1.5 A (typical)
    • Wide Input Supply Voltage Operating Range: 4.5 V to 18 V
    • Low Shoot-Through/Cross-Conduction Current in Output Stage
    • High Capacitive Load Drive Capability:
      • 1000 pF in 11.5 ns (typical
      • Short Delay Times: 33 ns (tD1), 24 ns (tD2) (typical)
    • Low Supply Current: 375 μA (typical)
    • Low Voltage Threshold Input and Enable with Hysteresis: 1.2 to 1.6 V
    • Latch-Up Protected: Withstands 500 mA Reverse Current
    • Space-Saving Packages:
      • 6L SOT-23
      • 6L 2x2 DFN

Documents

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Data Sheets

06/24/2015
665KB

Development tools data is currently unavailable.

RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
MCP14A0154-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
MCP14A0154T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
MCP14A0155-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
MCP14A0155T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
MCP14A0153T-E/MS
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
MCP14A0153-E/MS
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
MCP14A0151T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
MCP14A0152T-E/MAY
0.014800
0.258333
6
DFN
2x2x0.9mm
NiPdAu
e4
MCP14A0153T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
MCP14A0154T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
MCP14A0155T-E/MNY
0.014300
0.248485
8
TDFN
2x3x0.8mm
NiPdAu
e4
MCP14A0153-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14A0153T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14A0154-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14A0154T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14A0155-E/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14A0155T-E/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
MCP14A0151T-E/CH
0.017000
0.046667
6
SOT-23
-
Matte Tin
e3
MCP14A0152T-E/CH
0.017000
0.046667
6
SOT-23
-
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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