Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes
product primary image

IS1690

Status: In Production

Features:

  • Compliant with Bluetooth Specification v.3.0 + EDR in 2.4 GHz ISM band
  • Hands Free 1.5
  • Headset 1.0
  • A2DP 1.0
  • AVRCP 1.0
  • 16MHz main clock input
  • Built-in internal ROM for program memory
  • Supports connection to two hosts (phones, tablets, etc.) with HFP or A2DP profiles simultaneously
  • Adaptive Frequency Hopping (AFH) avoids occupied RF channels
  • Fast Connection supported 
  • Supports A-Law or µ-Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation
  • Noise suppression
  • Echo suppression
  • SBC decoding
  • Packet loss concealment
  • Built-in one language (English) voice prompts and 20 events for each one
  • 16 bit DAC and 16 bit ADC codec
  • 94dB SNR DAC playback
  • 85 dB SNR ADC.
  • Built-in Lithium-ion battery charger (up to 350mA)
  • Integrated 3V, 1.8V configurable switching regulator and LDO
  • Built-in ADC for battery monitor and voltage sense.
  • A line-in port for external audio input
  • Two LED drivers
  • High speed HCI-UART (Universal Asynchronous
  • Receiver Transmitter) interface (up to 921600bps)
  • 7 x 7 mm2 56QFN package
View More
Overview
Documents
Development Environment
RoHS Information
Add To Cart

Device Overview

Summary

The IS1690 multi-speaker stereo audio chip is a compact, highly integrated, CMOS single-chip RF and baseband IC for Bluetooth v3.0 +EDR 2.4GHz applications.  This chip is fully compliant with Bluetooth specifications and completely backward-compatible with Bluetooth  2.0 or 1.2 systems.  It incorporates Bluetooth 1M/2M/3Mbps RF, single-cycle 8bit MCU, TX/RX modem, 5-port memory controller, task/hopping controller, UART interface, and ISSC’s own Bluetooth software stack to achieve the required BT v3.0 with EDR functions.

For superior audio and voice quality, it also integrates a DSP co-processor, a PLL, and a CODEC dedicated for voice and audio applications.  For voice, it supports not only basic CVSD encoding and decoding but also enhanced noise reduction and echo cancellation are implemented by the built-in DSP to achieve better quality in both sending and receiving sides. For the enhanced audio applications, SBC decoding functions can also be carried out by DSP to satisfy Bluetooth A2DP requirements.

Additional Features
      System Specification
      • Compliant with Bluetooth Specification v.3.0 + EDR in 2.4 GHz ISM band
      • Supports the following profiles:
        • Hands Free 1.5
        • Headset 1.0
        • A2DP 1.0
        • AVRCP 1.0
      Baseband Hardware
      • 16MHz main clock input
      • Built-in internal ROM for program memory
      • Supports connection to two hosts (phones, tablets, etc.) with HFP or A2DP profiles simultaneously
      • Adaptive Frequency Hopping (AFH) avoids occupied RF channels
      • Fast Connection supported 
      Audio processor
        • Supports A-Law or µ-Law PCM format, or CVSD (Continuous Variable Slope Delta Modulation) for SCO channel operation
        • Noise suppression
        • Echo suppression
        • SBC decoding
        • Packet loss concealment
        • Built-in one language (English) voice prompts and 20 events for each one
        Audio Codec
          • 16 bit DAC and 16 bit ADC codec
          • 94dB SNR DAC playback
          • 85 dB SNR ADC.
          Peripherals
          • Built-in Lithium-ion battery charger (up to 350mA)
          • Integrated 3V, 1.8V configurable switching regulator and LDO
          • Built-in ADC for battery monitor and voltage sense.
          • A line-in port for external audio input
          • Two LED drivers
          Flexible HCI interface
          • High speed HCI-UART (Universal Asynchronous
          • Receiver Transmitter) interface (up to 921600bps)
          Package
          • 7 x 7 mm2 56QFN package
      Parametrics
      Name
      Value
      Bluetooth Classic-Audio
      Yes
      Audio Channels
      Stereo
      Analog Audio Out
      Yes
      MIC-in
      1
      Line-in
      Yes
      I2C
      1
      TX Power
      +4dBm
      GPIO
      10
      Pin Count
      56
      Package Type
      QFN
      Package Size
      7 x 7 mm
      Temperature Range
      -20C to 70C
      Operating Voltage Range
      3.0 to 4.25

      Documents

      Jump to:

      Data Sheets

      07/20/2015
      1586KB

      Application Notes

      07/20/2015
      2752KB

      Software Libraries/Firmware

      12/09/2015
      950KB
      07/20/2015
      2956KB

      User Guides

      07/20/2015
      999KB
      07/20/2015
      1093KB

      Development tools data is currently unavailable.

      RoHS Information

      Part Number
      Device Weight (g)
      Shipping Weight (grams)
      Lead Count
      Package Type
      Package Width
      Solder Composition
      JEDEC Indicator
      RoHS
      China EFUP
      IS1690S-255
      0.136500
      0.301333
      56
      VQFN
      7x7x0.9mm
      Matte Tin
      e3
      IS1690S-255-TRAY
      0.136500
      0.471154
      56
      VQFN
      7x7x0.9mm
      Matte Tin
      e3
      IS1690SM-253
      0.136500
      0.301333
      56
      VQFN
      7x7x0.9mm
      Matte Tin
      e3
      IS1690SM-253-TRAY
      0.136500
      0.471154
      56
      VQFN
      7x7x0.9mm
      Matte Tin
      e3
      To see a complete listing of RoHS data for this device, please Click here
      Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

      Buy from the Microchip Store

      Grid
      View
      Table
      View
      Filter:
      Apply
      Clear
      Only show products with samples
      Product
      Leads
      Package Type
      Temp Range
      Packing Media
      5K Pricing
      Buy