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ATBTLC1000

Bluetooth Low Energy System on a Chip

Status: Not Recommended for new designs

Features:

  • Available in certified modules ATBTLC1000-MR
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Overview
Documents
Development Environment
RoHS Information
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Device Overview

Summary

The ATBTLC1000 is an ultra-low power Bluetooth® Low Energy System on a Chip with Integrated ARM Cortex-M0 MCU, Transceiver, Modem, MAC, PA, TR Switch, and Power Management Unit (PMU).  It can be used as a Bluetooth Low Energy link controller or data pump with external host MCU.

The qualified Bluetooth Low Energy protocol stack is stored in dedicated ROM, the firmware includes L2CAP service layer protocols, Security Manager, Attribute protocol (ATT), Generic Attribute Profile (GATT) and the Generic Access Profile (GAP).  Additionally, application profiles such as Proximity, Thermometer, Heart Rate, Blood Pressure, and many others are supported and included in the protocol stack.

The ATBTLC1000 is available in a QFN or WLCSP package or as a certified module.  The fully-certified ATBTLC1000-MR110CA module is available now for purchase.

Microchip's complimentary and confidential Wireless Check online design review service is available for customers who have selected our products for their application design-in*.
*The online design review service is subject to Microchip's Program Terms and Conditions and requires a myMicrochip account.

Please consider this device ATBTLC1000-XR, ATBTLC1000-ZR

Additional Features
  • Available in certified modules ATBTLC1000-MR
  • Low Power sleep and transmit modes
  • Available in WLCSP (2.26 x 2.14mm) or QFN (32pin 4x4 mm)
  • Optimized system cost - High level of integration on chip reduces external Bill of Material significantly
  • Wide operating voltage range:  1.8 – 4.3V
  • Bluetooth 5 Certified
  • Parameter host interface:  UART
  • RoHS compliant
Parametrics
Name
Value
Bluetooth Low Energy
Yes
I2C
2
SPI
Yes
GPIO
12
Pin Count
32
Package Type
WLCSP
Package Size
2 × 2 mm
Temperature Range
-40 to +85C
Operating Voltage Range
1.8 to 4.3
CPU
Cortex-M0

Documents

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Supporting Collateral

Release Notes

Software Libraries/Firmware

Development Environment

  • Demo & Evaluation Boards
Demo & Evaluation Boards
BTLC1000-XPRO
BTLC1000-XPRO ( ATBTLC1000-XPRO )

Microchip's BTLC1000 Xplained Pro extension evaluation kit is used to evaluate the ATBTLC1000-MR110CA BLE module. The BTLC1000 MR110CA module is based on Microchip's industry – leading lowest power Bluetooth Low Energy 4.1 compliant SoC, ATBLTC1000-MU-T. The XPro extension can be plugged into any of the supported Microchip's host MCU Xplained Pro evaluation boards to quickly add Bluetooth...

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BTLC1000-XPRO-ADPT
BTLC1000-XPRO-ADPT ( ATBTLC1000-XPRO-ADPT )
(Not Recommended for new design)

The ATBTLC1000-XPRO-ADPT is an adapter board for the ATBTLC1000-XPRO expansion board. It is required for the UART hardware flow control functionality to operate correctly when the ATBTLC1000-XPRO expansion board is connected to certain Xplained MCU base boards.

The BTLC1000XPRO-ADP adapter board supports the SMART SAM L21 Xplained Pro, SAM D21 Xplained Pro, SAM 4S Xplained Pro and

...

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BTLC1000-XSTK
BTLC1000-XSTK ( ATBTLC1000-XSTK )
(Not Recommended for new design)

The BTLC1000 Xplained Starter Kit is a hardware platform to evaluate the ATBTLC1000-MR110CA module with the ARM Cortex M0+ SAML21 Xplained Pro host MCU evaluation board. The Xplained Pro extension plugs into the SAML21 Xplained Pro evaluation board to quickly add Bluetooth Smart connectivity. The ATBTLC1000-MR110CA module is based on s industry leading lowest power Bluetooth Low Energy 4.1

...

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Ultra Low Power Demo w SAML21 & BTLC1000
Ultra Low Power Demo w SAML21 & BTLC1000 ( ATULPC-DEMO )

The ATULPC-DEMO demo uses a SAM L21 MCU, interfaced with BTLC1000 fully certified module and several sensors on a small form factor PCB (40mm x 30mm) operated on a coin cell battery. The environment sensor data (temperature, pressure, humidity, light), motion sensor data (3-axis acceleration, gyroscope) and sensor fusion data (3D plot, step count, free fall detection) are sent using BLE and

...

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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
ATBTLC1000-MR110CA
1.680000
24
MODULE
xxmm
ENIG
b4
ATBTLC1000-ZR110CA
0.700000
35
MODULE
 
ENIG
b4
ATBTLC1000A-MU-Y
0.041160
0.040741
32
VQFN
4x4x0.9mm
Matte Tin
e3
ATBTLC1000A-MU-T
0.041160
0.341500
32
VQFN
4x4x0.9mm
Matte Tin
e3
ATBTLC1000A-UU-T
0.004900
0.199333
31
WLCSP
2.275x2.155x0.504mm
SACQ
e1
ATBTLC1000-XR1100A
0.551020
49
LFLGA
4.5x5.5x1.4mm
NiPdAu
e4
ATBTLC1000-XR1100AT
0.150000
49
LFLGA
4.5x5.5x1.4mm
NiPdAu
e4
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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