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16F630

Status: End of Life

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RoHS Information
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RoHS Information

Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
PIC16F630-E/ML
0.041700
0.076923
16
QFN
4x4x0.9mm
Matte Tin
e3
PIC16F630-I/ML
0.041700
0.076923
16
QFN
4x4x0.9mm
Matte Tin
e3
PIC16F630T-I/ML
0.041700
0.212121
16
QFN
4x4x0.9mm
Matte Tin
e3
PIC16F630-E/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
PIC16F630-I/ST
0.060000
0.125000
14
TSSOP
4.4mm
Matte Tin
e3
PIC16F630T-E/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
PIC16F630T-I/ST
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
PIC16F630T-I/STVAO
0.060000
0.246800
14
TSSOP
4.4mm
Matte Tin
e3
PIC16F630-C/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC16F630-E/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC16F630-I/SL
0.143200
0.280702
14
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC16F630T-C/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC16F630T-E/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC16F630T-I/SL
0.143200
0.325000
14
SOIC
.150In(3.90mm)
Matte Tin
e3
PIC16F630-C/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
PIC16F630-E/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
PIC16F630-I/P
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
PIC16F630-I/PG
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
To see a complete listing of RoHS data for this device, please Click here
Shipping Weight = Device Weight + Packing Material weight. Please contact sales office if device weight is not available.

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