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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33FJ16GP102-E/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ16GP102-H/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ16GP102-I/ML
0.101600
0.163934
28
QFN
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ16GP102T-E/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ16GP102T-I/ML
0.101600
0.332500
28
QFN
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ16GP102-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33FJ16GP102-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ16GP102T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ16GP102-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download