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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33FJ128MC802-H/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ128MC802T-H/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ128MC802T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ128MC802-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ128MC802T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ128MC802-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33FJ128MC802-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802-H/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802T-H/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802-E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
DSPIC33FJ128MC802-I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download