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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33EP64GS502-I/WC05
0.000000
1000.000
0
Wafer
Varies
-
-
 
DSPIC33EP64GS502T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502-I/MMC07
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502T-I/MMC07
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502-I/MMC12
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502T-I/MMC12
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP64GS502-E/2N
0.003500
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3
download
DSPIC33EP64GS502-I/2N
0.003500
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3
download
DSPIC33EP64GS502T-E/2N
0.003500
0.181212
28
UQFN
6x6x0.55mm
Matte Tin
e3
download
DSPIC33EP64GS502T-I/2N
0.003500
0.181212
28
UQFN
6x6x0.55mm
Matte Tin
e3
download
DSPIC33EP64GS502-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP64GS502-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP64GS502T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP64GS502T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download