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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33EP32GS202T-I/MMC02
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP32GS202T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP32GS202T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP32GS202-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP32GS202-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP32GS202-E/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
DSPIC33EP32GS202-I/MX
0.002900
0.114754
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
DSPIC33EP32GS202T-E/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
DSPIC33EP32GS202T-I/MX
0.002900
0.181212
28
UQFN
6x6x0.5mm
Matte Tin
e3
download
DSPIC33EP32GS202-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33EP32GS202T-E/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33EP32GS202T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33EP32GS202-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33EP32GS202-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP32GS202-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP32GS202T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP32GS202T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP32GS202-E/M6
0.026500
0.109890
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
DSPIC33EP32GS202-E/M6C01
0.026500
0.109890
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
DSPIC33EP32GS202-I/M6
0.026500
0.109890
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
DSPIC33EP32GS202T-E/M6
0.026500
0.212121
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
DSPIC33EP32GS202T-E/M6C01
0.026500
0.212121
28
UQFN
4x4x0.6mm
Matte Tin
e3
download
DSPIC33EP32GS202T-I/M6
0.026500
0.212121
28
UQFN
4x4x0.6mm
Matte Tin
e3
download