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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33EP256MU814-E/PH
0.685500
3.888889
144
TQFP
16x16x1mm
Matte Tin
e3
download
DSPIC33EP256MU814-I/PH
0.685500
3.888889
144
TQFP
16x16x1mm
Matte Tin
e3
download
DSPIC33EP256MU814T-E/PH
0.685500
1.261111
144
TQFP
16x16x1mm
Matte Tin
e3
download
DSPIC33EP256MU814T-I/PH
0.685500
1.261111
144
TQFP
16x16x1mm
Matte Tin
e3
download
DSPIC33EP256MU814-E/PL
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
DSPIC33EP256MU814-E/PLVAO
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
DSPIC33EP256MU814-I/PL
1.392800
7.833333
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
DSPIC33EP256MU814T-E/PL
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
download
DSPIC33EP256MU814T-I/PL
1.392800
2.285714
144
LQFP
20x20x1.4mm
Matte Tin
e3
download