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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33EP256GM710-H/BG
0.192400
1.777174
121
TFBGA
10x10x1.20mm
SAC
e1
download
DSPIC33EP256GM710T-I/BG
0.192400
0.481818
121
TFBGA
10x10x1.20mm
SAC
e1
download
DSPIC33EP256GM710-I/BG
0.192400
1.777174
121
TFBGA
10x10x1.20mm
SAC
e1
download
DSPIC33EP256GM710-E/BG
0.192400
1.777174
121
TFBGA
10x10x1.20mm
SAC
e1
download
DSPIC33EP256GM710-E/PF
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
download
DSPIC33EP256GM710-E/PT
0.391000
1.596639
100
TQFP
12x12x1mm
Matte Tin
e3
download
DSPIC33EP256GM710-I/PT
0.391000
1.596639
100
TQFP
12x12x1mm
Matte Tin
e3
download
DSPIC33EP256GM710-I/PF
0.497000
2.333333
100
TQFP
14x14x1mm
Matte Tin
e3
download