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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33EP128GS702-I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP128GS702T-E/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP128GS702T-I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP128GS702-E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC33EP128GS702-E/2N
 
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33EP128GS702-I/2N
 
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33EP128GS702T-E/2N
 
0.181212
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33EP128GS702T-I/2N
 
0.181212
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33EP128GS702-I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP128GS702-E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP128GS702T-E/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC33EP128GS702T-I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download