Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC33CK256MP502-E/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33CK256MP502-I/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33CK256MP502T-I/SS
0.229200
0.333333
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33CK256MP502-H/SS
0.229200
0.489362
28
SSOP
.209in
Matte Tin
e3
download
DSPIC33CK256MP502-E/2N
 
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33CK256MP502-I/2N
 
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33CK256MP502T-I/2N
 
0.181212
28
UQFN
6x6x0.55mm
Matte Tin
e3
 
DSPIC33CK256MP502-H/2N
 
0.114754
28
UQFN
6x6x0.55mm
Matte Tin
e3