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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC30F4012-20I/ML
0.188400
0.288889
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F4012-30I/ML
0.188400
0.288889
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F4012-20E/ML
0.188400
0.288889
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F4012-20I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F4012-30I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F4012-20E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F4012-20E/SOVAO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F4012-20E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
DSPIC30F4012-20I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
DSPIC30F4012-30I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download