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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC30F3012-20E/ML
0.188400
0.288889
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F3012-30I/ML
0.188400
0.288889
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F3012T-20I/ML
0.188400
0.437500
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F3012-20I/ML
0.188400
0.288889
44
QFN
8x8x0.9mm
Matte Tin
e3
download
DSPIC30F3012-20E/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
DSPIC30F3012-20I/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
DSPIC30F3012-30I/SO
0.481000
0.857143
18
SOIC
.300in
Matte Tin
e3
download
DSPIC30F3012T-20I/SO
0.481000
1.000909
18
SOIC
.300in
Matte Tin
e3
download
DSPIC30F3012-20E/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download
DSPIC30F3012-20I/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download
DSPIC30F3012-30I/P
1.248000
2.200000
18
PDIP
.300in
Matte Tin
e3
download