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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
DSPIC30F2020-30I/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC30F2020-20E/MM
0.101600
0.163934
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC30F2020T-30I/MM
0.101600
0.418750
28
QFN-S
6x6x0.9mm
Matte Tin
e3
download
DSPIC30F2020-20E/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F2020-30E/SOB34
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F2020-30I/SO
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F2020T-30E/SOB34
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F2020T-30I/SO
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
DSPIC30F2020-20E/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
DSPIC30F2020-30I/SP
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download