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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
USBF4100-I/SN
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100T-I/SN
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100T-I/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100-E/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100T-E/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100-V/SNVAO
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100T-V/SNVAO
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
USBF4100T-I/NP
0.006200
0.150000
8
UDFN
2x3x0.55mm
Matte Tin
e3
download
USBF4100T-I/NPVAO
0.006200
0.150000
8
UDFN
2x3x0.55mm
Matte Tin
e3
download
USBF4100T-V/NP
0.006200
0.150000
8
UDFN
2x3x0.55mm
Matte Tin
e3
download
USBF4100T-V/NPVAO
0.006200
0.150000
8
UDFN
2x3x0.55mm
Matte Tin
e3
download