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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
USB5807/KD
0.295100
1.250000
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807-I/KD
0.295100
1.250000
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807T/KD
0.295100
0.686400
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807T-I/KD
0.295100
0.686400
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807C/KD
0.295100
1.250000
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807C-I/KD
0.295100
1.250000
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807CT/KD
0.295100
0.686400
100
VQFN
12X12X0.9mm
Matte Tin
e3
download
USB5807CT-I/KD
0.295100
0.686400
100
VQFN
12X12X0.9mm
Matte Tin
e3
download