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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC7660DWP
0.000000
1000.000
0
DICE
Varies
-
-
 
TC7660DWF
0.000000
1000.000
0
WAFER
Varies
-
-
 
TC7660WWF
0.000000
1000.000
0
WAFER
Varies
-
-
 
TC7660COA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC7660COA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC7660EOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC7660EOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC7660HEOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC7660HCOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC7660IJA
1.022410
0.800000
8
CERDIP
.300in
SAC
e1
download
TC7660MJA
1.022410
0.800000
8
CERDIP
.300in
SAC
e1
download
TC7660CPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC7660EPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download