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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC647BEUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC647BEUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC647EUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC647EUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC647VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC647VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC647BEOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC647EOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC647EOATR
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC647VOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC647VOATR
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC647BEOATR
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC647BEPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC647VPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download