Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC646BEUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC646BEUA713
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC646EUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC646EUA713
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC646VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC646VUA713
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC646BEOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC646BEOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC646EOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC646EOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC646VOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC646VOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC646BEPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC646VPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download