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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC622COA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC622COA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC622EOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC622EOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC622VOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC622VOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC622CPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC622EPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC622VPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC622EAT
1.983900
3.120000
5
TO-220
 
Matte Tin
e3
download
TC622VAT
1.983900
3.120000
5
TO-220
 
Matte Tin
e3
download