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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC621HCOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC621HCOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC621HEOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC621HEOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC621HCPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC621HEPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download