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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC510COG
0.662000
1.645161
24
SOIC
.300in
Matte Tin
e3
download
TC510COG713
0.662000
1.000000
24
SOIC
.300in
Matte Tin
e3
download
TC510EOG
0.662000
1.645161
24
SOIC
.300in
Matte Tin
e3
download
TC514COI
0.770400
1.370370
28
SOIC
.300in
Matte Tin
e3
download
TC514COI713
0.770400
1.152500
28
SOIC
.300in
Matte Tin
e3
download
TC514CPJ
2.087500
3.733333
28
SPDIP
.300in
Matte Tin
e3
download
TC51N2202ECBTR
0.014900
0.042667
3
SOT-23A
-
Matte Tin
e3
download
TC51N2702ECBTR
0.014900
0.042667
3
SOT-23A
-
Matte Tin
e3
download
TC51N3002ECBTR
0.014900
0.042667
3
SOT-23A
-
Matte Tin
e3
download
TC51N5002ECBTR
0.014900
0.042667
3
SOT-23A
-
Matte Tin
e3
download