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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC500ACOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC500ACOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC500COE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC500COE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC500ACPE
1.112700
1.833333
16
PDIP
.300in
Matte Tin
e3
download
TC500CPE
1.112700
1.833333
16
PDIP
.300in
Matte Tin
e3
download