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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC4468MJDADO
0.000000
2.965517
14
CERDIP
.300in
SnPb
e0
 
TC4468COE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC4468COE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC4468EOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC4468EOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC4468MOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC4468MOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC4468CPD
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download
TC4468EPD
0.953300
1.833333
14
PDIP
.300in
Matte Tin
e3
download