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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Dimension
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC4425DWF
0.000000
1000.000
0
WAFER
Varies
-
-
 
TC4425DWFAAA
0.000000
1000.000
0
Wafer
Varies
-
-
 
TC4425EOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC4425COE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC4425COE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC4425EOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC4425VOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC4425VOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC4425CPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC4425VPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC4425EPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC4425EMF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
TC4425EMF713
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
TC4425VMF
0.076900
0.133333
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download
TC4425VMF713
0.076900
0.218182
8
DFN-S
6x5x0.9mm
Matte Tin
e3
download