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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC32MCDB
0.115700
0.217949
3
SOT-223
-
Matte Tin
e3
download
TC32MCDB713
0.115700
0.219250
3
SOT-223
-
Matte Tin
e3
download
TC32MEDB
0.115700
0.217949
3
SOT-223
-
Matte Tin
e3
download
TC32MEDB713
0.115700
0.219250
3
SOT-223
-
Matte Tin
e3
download
TC32MCZB
0.203400
0.219000
3
TO-92
-
Matte Tin
e3
download
TC32MEZB
0.203400
0.219000
3
TO-92
-
Matte Tin
e3
download