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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC1411NCPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC1411NCOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1411NEUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC1411NVUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC1411NVUA713
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC1411NEUA713
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC1411NCOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1411NEOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1411NEOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1411NVOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1411NVOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1411NEPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC1411NVPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download