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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC1232COA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1232COA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1232EOA
0.078000
0.250000
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1232EOA713
0.078000
0.230303
8
SOIC
.150In(3.90mm)
Matte Tin
e3
download
TC1232COE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC1232COE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC1232EOE
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
TC1232EOE713
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
TC1232CPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download
TC1232EPA
0.486700
0.900000
8
PDIP
.300in
Matte Tin
e3
download