Microchip logo
  • All
  • Products
  • Documents
  • Applications Notes

RoHS Device Search

 
Search
Send Email
Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
TC1174DWFM11
0.000000
1000.000
0
Wafer
Varies
-
-
 
TC1174DWP11
0.000000
1000.000
0
DICE
Varies
-
-
 
TC1174DWFMEAB
0.000000
1000.000
0
Wafer
Varies
-
-
 
TC1174VUA
0.025600
0.070000
8
MSOP
3x3mm
Matte Tin
e3
download
TC1174VUATR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC1174VUAMR
0.025600
0.215600
8
MSOP
3x3mm
Matte Tin
e3
download
TC1174VOA
0.078000
0.250000
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download
TC1174VOATR
0.078000
0.230303
8
SOIC
.1China RoHs 50.pngIn(3.90mm)
Matte Tin
e3
download