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Part Number
Device Weight (g)
Shipping Weight (grams)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
SY87701ALZG
0.792500
1.481482
28
SOIC
.300In
NiPdAu
e4
download
SY87701ALHG-TR
0.138900
0.656200
32
TQFP
7x7x1.0mm
Matte Tin
e3
download
SY87701ALHG
0.138900
0.985800
32
TQFP
7x7x1.0mm
Matte Tin
e3
download