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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
SST39VF1602-90-4C-V-CZ055
0.000000
1000.000
0
Wafer
Varies
-
-
 
SST39VF1602-90-4C-VD
0.000000
1000.000
0
WAFER
Varies
-
-
 
SST39VF1602-90-4C-V-CZ074
0.000000
1000.000
0
Wafer
Varies
-
-
 
SST39VF1602-70-4C-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
download
SST39VF1602-70-4C-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
download
SST39VF1602-70-4I-B3KE
0.094100
0.666667
48
TFBGA
6x8x1.2mm
SAC
e1
download
SST39VF1602-70-4I-B3KE-T
0.094100
0.336000
48
TFBGA
6x8x1.2mm
SAC
e1
download
SST39VF1602-70-4C-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
download
SST39VF1602-70-4C-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
download
SST39VF1602-70-4I-EKE
0.564500
2.770833
48
TSOP
12x20mm
Matte Tin
e3
download
SST39VF1602-70-4I-EKE-T
0.564500
0.940000
48
TSOP
12x20mm
Matte Tin
e3
download