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Part Number
Device Weight (g)
Shipping Weight (Kg)
Lead Count
Package Type
Package Width
Solder Composition
JEDEC Indicator
RoHS
China EFUP
Package Specification
SST26VF064BA-104I/W70S
0.000000
0.000000
0
Wafer
Varies
-
-
 
SST26VF064BA-104I/WF70S
0.000000
0.000000
0
Wafer
Varies
-
-
 
SST26VF064BA-104I/S70S
0.000000
1000.000
0
DICE
Varies
-
-
 
SST26VF064BA-104I/SM
0.124400
0.266667
8
SOIJ
.208in
Matte Tin
e3
download
SST26VF064BAT-104I/SM
0.124400
0.379048
8
SOIJ
.208in
Matte Tin
e3
download
SST26VF064BAT-104I/SO
0.438000
0.800000
16
SOIC
.300In
Matte Tin
e3
download
SST26VF064BA-104I/SO
0.438000
0.765957
16
SOIC
.300In
Matte Tin
e3
download
SST26VF064BA-104I/MF
0.073800
0.163265
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
download
SST26VF064BAT-104I/MF
0.073800
0.200000
8
TDFN-S
6x5x0.8mm
Matte Tin
e3
download